The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Sep. 17, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sang Ki Nam, Danville, CA (US);

Tae Seung Cho, San Jose, CA (US);

Ludovic Godet, Sunnyvale, CA (US);

Srinivas D. Nemani, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C23C 16/00 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); C23C 16/509 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45565 (2013.01); C23C 16/5096 (2013.01); C23C 16/52 (2013.01); H01J 37/3244 (2013.01); H01J 37/32082 (2013.01); H01J 37/32357 (2013.01);
Abstract

The present invention provides an apparatus having a plasma profile control plate disposed in a plasma processing chamber so as to locally alter plasma density to provide uniform plasma distribution across a substrate surface during processing. In one embodiment, a process kit includes a plate configured to be disposed in a plasma processing chamber, a plurality of apertures formed therethrough, the apertures configured to permit processing gases to flow through the plate, and an array of unit cells including at least one aperture formed in the plate, wherein each unit cell has an electrode assembly individually controllable relative to electrode assemblies disposed in at least two other unit cells.


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