The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Apr. 20, 2012
Applicants:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Inventors:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22F 1/08 (2006.01); C23C 14/34 (2006.01); B22F 3/14 (2006.01); C22C 1/04 (2006.01); C22C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3407 (2013.01); B22F 3/14 (2013.01); C22C 1/0425 (2013.01); C22C 1/0483 (2013.01); C22C 9/00 (2013.01); C22C 28/00 (2013.01); C23C 14/3414 (2013.01);
Abstract

Provided are a sputtering target which has excellent machinability and is capable of forming a compound film that mainly contains Cu and Ga and a method for producing the sputtering target. The sputtering target of the present invention has a component composition that contains 20 to 40 at % of Ga, 0.1 to 3 at % of Sb, and the balance composed of Cu and unavoidable impurities. A method for producing the sputtering target includes a step of producing a starting material powder that is obtained by pulverizing at least Cu, Ga and Sb as simple substances or an alloy that contains two or more of these elements; and a step of subjecting the starting material powder to hot processing in a vacuum, in an inert atmosphere or in a reducing atmosphere, wherein Ga is contained in the starting material powder in the form of a Cu—Ga alloy or in the form of a Ga—Sb alloy.


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