The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Jul. 13, 2012
Applicants:

Takashi Sagara, Fukushima, JP;

Hidetaka Kakiuchi, Fukushima, JP;

Keiko Kashihara, Osaka, JP;

Yuki Kitai, Osaka, JP;

Hirosuke Saito, Osaka, JP;

Daisuke Yokoyama, Hyogo, JP;

Hiroaki Fujiwara, Nara, JP;

Inventors:

Takashi Sagara, Fukushima, JP;

Hidetaka Kakiuchi, Fukushima, JP;

Keiko Kashihara, Osaka, JP;

Yuki Kitai, Osaka, JP;

Hirosuke Saito, Osaka, JP;

Daisuke Yokoyama, Hyogo, JP;

Hiroaki Fujiwara, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 171/00 (2006.01); B32B 15/08 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01); C08G 59/38 (2006.01); C08L 71/00 (2006.01); C08G 59/32 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08K 5/18 (2006.01); C08K 5/3445 (2006.01); C08K 5/5399 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09D 171/00 (2013.01); B32B 15/08 (2013.01); C08G 59/3218 (2013.01); C08G 59/38 (2013.01); C08G 59/42 (2013.01); C08G 59/5073 (2013.01); C08J 5/24 (2013.01); C08L 71/00 (2013.01); C08L 71/12 (2013.01); H05K 1/0353 (2013.01); B32B 2457/08 (2013.01); C08J 2371/12 (2013.01); C08J 2463/00 (2013.01); C08K 5/18 (2013.01); C08K 5/3445 (2013.01); C08K 5/5399 (2013.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); Y10T 428/31529 (2015.04);
Abstract

An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.


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