The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Jul. 22, 2013
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Matthew David Romig, Richardson, TX (US);
Marie-Solange Anne Milleron, Paris, FR;
Benjamin Michael Sutton, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); B81C 1/00 (2006.01); H03H 3/007 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); H03H 3/0076 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0154 (2013.01);
Abstract
A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.