The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Dec. 09, 2011
Applicant:
Dennis J. Miller, Sherwood, OR (US);
Inventor:
Dennis J. Miller, Sherwood, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); B01F 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0076 (2013.01); B01F 3/12 (2013.01); H05K 3/28 (2013.01); H05K 3/285 (2013.01); H05K 2201/0254 (2013.01);
Abstract
A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.
Quick Actions:
Miller, Dennis. (2016). Reducing dielectric loss in solder masks (U.S. Patent No. 9526180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9526180
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile