The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

May. 22, 2015
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Youhong Wu, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/12 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H01L 23/12 (2013.01); H05K 1/0298 (2013.01); H05K 3/4673 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3436 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01); H05K 2203/066 (2013.01); Y10T 29/49156 (2015.01);
Abstract

A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side.


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