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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9524932 B1

PDFFull Text
Date of Patent:
Dec. 20, 2016

Filed:

Jul. 02, 2015

Semiconductor device with combined passive device on chip back side

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Andreas Munding, Regensburg, DE;

Martin Gruber, Schwandorf, DE;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Shumaker & Sieffert, P.A.

Primary Examiner:

Dzung Tran

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/08 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 27/06 (2006.01); H01L 21/283 (2006.01); H01L 21/52 (2006.01); H01L 23/495 (2006.01); H01L 27/15 (2006.01); H01L 29/772 (2006.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/283 (2013.01); H01L 21/52 (2013.01); H01L 23/49541 (2013.01); H01L 23/642 (2013.01); H01L 25/16 (2013.01); H01L 25/167 (2013.01); H01L 27/0629 (2013.01); H01L 27/0694 (2013.01); H01L 27/15 (2013.01); H01L 28/60 (2013.01); H01L 29/772 (2013.01); H01L 33/005 (2013.01); H01L 33/38 (2013.01); H01L 33/483 (2013.01); H01L 28/40 (2013.01); H01L 2224/06181 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19103 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01);
Abstract

Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the capacitor are electrically isolated from each other. In one example, a semiconductor chip includes a substrate having a first side and a second side, wherein the second side is opposite the first side. The semiconductor chip further includes a semiconductor device formed on the first side of the substrate and an electrically insulating layer formed on at least a portion of the second side of the substrate. The semiconductor chip further includes a capacitor device formed on at least a portion of the electrically insulating layer on the second side of the substrate, wherein the capacitor device is electrically insulated from the semiconductor device.

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