The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Oct. 03, 2014
Applicant:

Mpi Corporation, Chu-Pei, Hsinchu Shien, TW;

Inventors:

Chun-Chi Wang, Chu-Pei, TW;

Chia-Tai Chang, Chu-Pei, TW;

Ya-Yun Cheng, Chu-Pei, TW;

Wei-Cheng Ku, Chu-Pei, TW;

Chao-Ping Hsieh, Chu-Pei, TW;

Assignee:

MPI CORPORATION, Hsinchu Hsiang, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 1/067 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/067 (2013.01); G01R 1/06772 (2013.01); G01R 31/02 (2013.01); G01R 31/2851 (2013.01); G01R 31/2889 (2013.01); Y10T 29/49218 (2015.01);
Abstract

An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.


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