The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Mar. 17, 2015
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Noboru Takeda, Tokyo, JP;

Hiroshi Morikazu, Tokyo, JP;

Xiaoming Qiu, Tokyo, JP;

Fumiteru Tashino, Tokyo, JP;

Ken Togashi, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/02 (2006.01); B23K 26/00 (2014.01); B23K 20/10 (2006.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); C03B 33/033 (2006.01); C03B 33/04 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 20/10 (2013.01); B23K 26/0006 (2013.01); B23K 26/0057 (2013.01); B23K 26/03 (2013.01); B23K 26/0624 (2015.10); B23K 26/0853 (2013.01); B23K 26/364 (2015.10); B23K 26/384 (2015.10); C03B 33/033 (2013.01); B23K 2201/40 (2013.01); B23K 2203/52 (2015.10); B65G 2249/04 (2013.01); C03B 33/04 (2013.01);
Abstract

A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.


Find Patent Forward Citations

Loading…