The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Sep. 25, 2015
Applicants:

Xiang LI, Portland, OR (US);

Stephen H. Hall, Forest Grove, OR (US);

Inventors:

Xiang Li, Portland, OR (US);

Stephen H. Hall, Forest Grove, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/79 (2011.01); H01R 43/20 (2006.01);
U.S. Cl.
CPC ...
H01R 12/79 (2013.01); H01R 43/205 (2013.01);
Abstract

Techniques and mechanisms for coupling a flexible circuit device to another device. In an embodiment, a substrate includes a first side and a second side opposite the first side, where first contacts of a hardware interface are disposed on the first side, and second contacts of the hardware interface are disposed on the second side. First interconnects and second interconnects variously extend in the substrate, where the first contacts are coupled via the first side each to a respective one of the first interconnects, and the second contacts are coupled via the second side each to a respective one of the second interconnects. In another embodiment, the substrate is one of a flexible substrate and a printed circuit board substrate, where the first interface is configured to couple the substrate, in an edge-to-edge configuration, with the other of a flexible substrate and a printed circuit board substrate.


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