The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Feb. 14, 2014
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Masayuki Furuhashi, Tokyo, JP;

Hiroaki Okabe, Tokyo, JP;

Tomokatsu Watanabe, Tokyo, JP;

Masayuki Imaizumi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/24 (2006.01); H01L 21/336 (2006.01); H01L 29/78 (2006.01); H01L 21/425 (2006.01); H01L 29/16 (2006.01); H01L 21/04 (2006.01); H01L 29/34 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/049 (2013.01); H01L 29/1033 (2013.01); H01L 29/1095 (2013.01); H01L 29/34 (2013.01); H01L 29/66068 (2013.01); H01L 29/78 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H01L 29/0696 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01);
Abstract

A semiconductor device capable of reducing ON-resistance changes with temperature, including a semiconductor substrate of a first conductivity type, a drift layer of the first conductivity type formed on the semiconductor substrate, a first well region of a second conductivity type formed in the front surface of the drift layer, a second well region of the second conductivity type formed in the front surface of the drift layer, and a gate structure that is formed on the front surface of the drift layer and forms a channel in the first well region and a channel in the second well region. A channel resistance of the channel formed in the first well region has a temperature characteristic that the channel resistance decreases with increasing temperature and a channel resistance of the channel formed in the second well region has a temperature characteristic that the channel resistance increases with increasing temperature.


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