The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Mar. 23, 2015
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chun-Wei Yu, Changhua County, TW;

Ted Ming-Lang Guo, Tainan, TW;

Hsu Ting, Tainan, TW;

Yu-Ren Wang, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/283 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/283 (2013.01); H01L 21/3085 (2013.01); H01L 21/823878 (2013.01);
Abstract

A method for manufacturing semiconductor devices includes following steps. A substrate including a first gate structure and a second gate structure formed thereon is provided. The first gate structure and the second gate structure are complementary to each other. Next, a first mask layer covering the second gate structure is formed and followed by forming first recesses in the substrate at two respective sides of the first transistor. Then, forming the first recesses, a first epitaxial layer is formed in each first recess. After forming the first epitaxial layers, a local protecting cap is formed on the first epitaxial layers and followed by removing the first mask layer.


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