The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Dec. 28, 2012
Applicants:

Christopher J. Jezewski, Hillboro, OR (US);

James S. Clarke, Portland, OR (US);

Tejaswi K. Indukuri, Hillsboro, OR (US);

Florian Gstrein, Portland, OR (US);

Daniel J. Zierath, Portland, OR (US);

Inventors:

Christopher J. Jezewski, Hillboro, OR (US);

James S. Clarke, Portland, OR (US);

Tejaswi K. Indukuri, Hillsboro, OR (US);

Florian Gstrein, Portland, OR (US);

Daniel J. Zierath, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/485 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76841 (2013.01); H01L 21/76843 (2013.01); H01L 21/76847 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76883 (2013.01); H01L 23/485 (2013.01); H01L 23/5226 (2013.01); H01L 23/53261 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A metal interconnect comprising cobalt and method of forming a metal interconnect comprising cobalt are described. In an embodiment, a metal interconnect comprising cobalt includes a dielectric layer disposed on a substrate, an opening formed in the dielectric layer such that the substrate is exposed. The embodiment further includes a seed layer disposed over the substrate and a fill material comprising cobalt formed within the opening and on a surface of the seed layer.


Find Patent Forward Citations

Jezewski, Christopher. (2016). Cobalt based interconnects and methods of fabrication thereof (U.S. Patent No. 9514983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9514983

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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