The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Dec. 30, 2014
Applicants:

Canon Nanotechnologies, Inc., Austin, TX (US);

Molecular Imprints, Inc., Austin, TX (US);

Inventors:

Zhengmao Ye, Austin, TX (US);

Dwayne L. LaBrake, Cedar Park, TX (US);

Assignees:

Canon Nanotechnologies, Inc., Austin, TX (US);

Molecular Imprints, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 21/3105 (2006.01); H01L 21/283 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); G03F 7/0002 (2013.01); H01L 21/02532 (2013.01); H01L 21/02623 (2013.01); H01L 21/283 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01); H01L 21/31144 (2013.01); H01L 21/32051 (2013.01);
Abstract

Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.


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