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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9512529 B1

PDFFull Text
Date of Patent:
Dec. 06, 2016

Filed:

Jun. 04, 2013

Electroplating baths of silver and tin alloys

Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Adolphe Foyet, Luzernerstrasse, CH;

Margit Clauss, Kriens, CH;

Wan Zhang-Beglinger, Adligenswil, CH;

Julia Woertink, Sudbury, MA (US);

Yi Qin, Marlborough, MA (US);

Jonathan Prange, Lincoln, MA (US);

Pedro O Lopez Montesinos, Marlborough, MA (US);

Assignee:

Rohm and Haas Electronic Materials LLC;

Attorney:

John J. Piskorski

Primary Examiner:

Louis Rufo

Int. Cl.
CPC ...
C25D 3/60 (2006.01); H01L 23/00 (2006.01); C25D 3/64 (2006.01); C25D 5/50 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
C25D 3/60 (2013.01); C25D 3/64 (2013.01); C25D 5/505 (2013.01); C25D 7/123 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/13111 (2013.01); H01L 2924/01322 (2013.01);
Abstract

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Find Patent Forward Citations

Foyet, Adolphe. (2016). Electroplating baths of silver and tin alloys (U.S. Patent No. 9512529). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9512529

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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