The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Apr. 06, 2012
Applicants:

Errol Antonio C. Sanchez, Tracy, CA (US);

David K. Carlson, San Jose, CA (US);

Satheesh Kuppurao, San Jose, CA (US);

Inventors:

Errol Antonio C. Sanchez, Tracy, CA (US);

David K. Carlson, San Jose, CA (US);

Satheesh Kuppurao, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/54 (2006.01); C23C 16/06 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/54 (2013.01); C23C 16/06 (2013.01); C23C 16/4412 (2013.01); C23C 16/45565 (2013.01); C23C 16/45574 (2013.01); H01L 21/67115 (2013.01); H01L 21/67184 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01);
Abstract

Apparatus for processing substrates are provided. In some embodiments, a processing system may include a first transfer chamber and a first process chamber coupled to the transfer chamber, the process chamber further comprising a substrate support to support a processing surface of a substrate within the process chamber, an injector disposed to a first side of the substrate support and having a first flow path to provide a first process gas and a second flow path to provide a second process gas independent of the first process gas, wherein the injector provides the first and second process gases across the processing surface of the substrate, a showerhead disposed above the substrate support to provide the first process gas to the processing surface, and an exhaust port disposed to a second side of the substrate support, opposite the injector, to exhaust the first and second process gases from the process chamber.


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