The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Mar. 16, 2016
Subtron Technology Co., Ltd., Hsinchu County, TW;
Shih-Hao Sun, Hsinchu County, TW;
Subtron Technology Co., Ltd., Hsinchu County, TW;
Abstract
A package carrier suitable for carrying at least a chip is provided. The package carrier includes an insulating layer, a patterned circuit layer, a plurality of conductive connection structures, a plurality of pads, a solder resist layer and a surface treatment layer. The insulating layer has a first surface and a second surface opposite to each other. The patterned circuit layer is embedded in the second surface and has a bonding surface. The second surface and the bonding surface are coplanar, and the patterned circuit layer comprises at least one die pad. The conductive connection structures are embedded in the insulating layer and connected to the patterned circuit layer. The pads are disposed on the first surface and connected to the conductive connection structures respectively. The solder resist layer is disposed on the second surface, and the surface treatment layer is disposed on the bonding surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile