The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Nov. 12, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Clement Hsingjen Wann, Carmel, NY (US);

Chih-Hsin Ko, Fongshan, TW;

Yao-Tsung Huang, Kaohsiung, TW;

Cheng-Ying Huang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 29/165 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A device including a silicon substrate, a silicon germanium layer, a silicon layer, a gate stack, and silicon-containing stressors is provided. In an embodiment, the silicon germanium layer is disposed over a silicon substrate and relaxed while the silicon layer is disposed over the silicon germanium layer and un-relaxed. The silicon layer may be free from germanium. The gate stack is of an n-type metal-oxide-semiconductor (NMOS) field-effect transistor (FET) and disposed over the silicon layer and the silicon germanium layer. A portion of the silicon layer forms a channel region of the NMOS FET. The silicon-containing stressors are formed in recesses in the silicon layer and have a lattice constant smaller than a lattice constant of the silicon germanium layer.


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