The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Nov. 25, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kyosuke Hiwatashi, Kumamoto, JP;

Kazunori Inoue, Kumamoto, JP;

Kouji Oda, Kumamoto, JP;

Nobuaki Ishiga, Kumamoto, JP;

Kensuke Nagayama, Kumamoto, JP;

Naoki Tsumura, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 21/47 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 21/47 (2013.01); H01L 27/1225 (2013.01); H01L 27/1288 (2013.01); H01L 29/66969 (2013.01);
Abstract

A gate wiring, a source electrode, a source-electrode connecting wiring, a pixel electrode, a gate-terminal extraction electrode, and a source-terminal extraction electrode are formed in the same layer on a planarization insulating film. The gate wiring is connected to a gate electrode through a gate-electrode-portion contact hole. The source electrode is connected to a semiconductor film through a source-electrode-portion contact hole. The source-electrode connecting wiring is connected to the semiconductor film and a source wiring through the source-electrode-portion contact hole and a source-wiring-portion contact hole, respectively. The pixel electrode is connected to the semiconductor film through a drain (pixel)-electrode-portion contact hole.


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