The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Feb. 02, 2015
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
The method of fabricating a semiconductor package including preparing a semiconductor wafer having a first side and a second side, the second side facing the first side, and the semiconductor wafer including a through via exposed through the first side, forming trenches at cutting areas between chip areas and at edge areas of the semiconductor wafer on the first side, stacking a semiconductor chip on the through via, forming an under fill resin layer to fill a gap between the semiconductor chip and the semiconductor wafer and to cover a side of the semiconductor chip, and forming a molding layer to cover at least a portion of the under fill resin layer and to fill at least a portion of the respective trenches may be provided.