The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Oct. 20, 2014
Shinko Electric Industries Co., Ltd., Nagano, JP;
Koji Hara, Nagano, JP;
Yoshihiro Ihara, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.