The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Nov. 02, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dong-kwon Kim, Yongin-si, KR;

Ki-il Kim, Yongin-si, KR;

Ah-young Cheon, Suwon-si, KR;

Myeong-cheol Kim, Suwon-si, KR;

Yong-jin Kim, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/3213 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/3065 (2013.01); H01L 21/3086 (2013.01); H01L 21/30655 (2013.01); H01L 21/32139 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of forming a pattern includes forming a mask pattern on a substrate; etching the substrate by deep reactive ion etching (DRIE) and by using the mask pattern as an etch mask; partially removing the mask pattern to expose a portion of an upper surface of the substrate; and etching the exposed portion of the upper surface of the substrate. In the method, when a pattern is formed by DRIE, an upper portion of the pattern does not protrude or scarcely protrudes, and scallops of a sidewall of the pattern are smooth, and thus a conformal material layer may be easily formed on a surface of the pattern.


Find Patent Forward Citations

Loading…