The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Nov. 03, 2015
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); B23K 3/06 (2006.01); H01L 23/488 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); B23K 3/0623 (2013.01); H01L 21/4867 (2013.01); H01L 21/76802 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/5226 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/742 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 23/488 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/1131 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/11416 (2013.01); H01L 2224/11618 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13015 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/014 (2013.01); H01L 2924/06 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/37001 (2013.01); H01L 2924/3841 (2013.01);
Abstract
A substrate bonding method is able to reliably bond substrates while avoiding a reduction in yield made worse by finer pitches. The substrate bonding method can include: forming an adhesive resin layer on a surface of a first substrate on which a pad has been formed; forming an opening on the adhesive resin layer above the pad; filling the opening with molten solder to form a pillar-shaped solder bump; and applying heat and pressure to the first substrate and a second substrate while a terminal formed on the second substrate is aligned with the solder bump.