The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9506874 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 29, 2016

Filed:

Apr. 20, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventor:

Ming Lei, Malta, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 3/00 (2006.01); G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01); G01B 11/16 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9505 (2013.01); G01B 11/161 (2013.01); G01N 21/8806 (2013.01); G01N 21/95692 (2013.01); G01N 2201/061 (2013.01); G01N 2201/0668 (2013.01); G01N 2201/12 (2013.01);
Abstract

An approach for IR-based metrology for detecting stress and/or defects around TSVs of semiconductor devices is provided. Specifically, in a typical embodiment, a beam of IR light will be emitted from an IR light source through the material around the TSV. Once the beam of IR light has passed through the material around the TSV, the beam will be analyzed using one or more algorithms to determine information about TSV stress and/or defects such as imbedded cracking, etc. In one embodiment, the beam of IR light may be split into a first portion and a second portion. The first portion will be passed through the material around the TSV while the second portion is routed around the TSV. After the first portion has passed through the material around the TSV, the two portions may then be recombined, and the resulting beam may be analyzed as indicated above.


Find Patent Forward Citations

Lei, Ming. (2016). Infrared-based metrology for detection of stress and defects around through silicon vias (U.S. Patent No. 9506874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9506874

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