The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jan. 31, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Beom-Taek Lee, Mountain View, CA (US);

Raul Enriquez-Shibayama, Zapopan, MX;

Carolina Garcia Robles, Tlaquepaque, MX;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H05K 1/0216 (2013.01); H05K 1/0245 (2013.01); H05K 1/0251 (2013.01); H05K 1/115 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/1461 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.


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