The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jan. 02, 2014
Applicant:

Siliconware Precision Industries Co., Ltd, Taichung, TW;

Inventors:

Hsin-Lung Chung, Taichung, TW;

Hao-Ju Fang, Taichung, TW;

Chih-Hsien Chiu, Taichung, TW;

Yude Chu, Taichung, TW;

Tsung-Hsien Tsai, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/40 (2006.01); H01Q 9/42 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/40 (2013.01); H01Q 9/42 (2013.01); H01Q 23/00 (2013.01);
Abstract

An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.


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