The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Apr. 16, 2015
Semiconductor integrated circuit device having encapsulation film and method of fabricating the same
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/12 (2013.01); H01L 45/06 (2013.01); H01L 45/1233 (2013.01); H01L 45/1675 (2013.01); H01L 45/143 (2013.01); H01L 45/144 (2013.01); H01L 45/148 (2013.01);
Abstract
A semiconductor integrated circuit device and a method of fabricating the same are disclosed. The semiconductor integrated circuit device includes a resistive layer and an encapsulation film formed to surround an outer wall of the resistive layer. The encapsulation film contains an oxygen absorbing ingredient.