The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Sep. 24, 2013
Applicant:

Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;

Inventors:

Shin-ichiro Takagi, Hamamatsu, JP;

Shingo Ishihara, Hamamatsu, JP;

Masaharu Muramatsu, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48997 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49429 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85951 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.


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