The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

May. 27, 2016
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yu-Ying Lin, Tainan, TW;

Kuang-Hsiu Chen, Tainan, TW;

Ted Ming-Lang Guo, Tainan, TW;

Yu-Ren Wang, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01); H01L 21/76 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02636 (2013.01); H01L 21/02529 (2013.01); H01L 21/02532 (2013.01); H01L 21/26513 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/76 (2013.01); H01L 29/0692 (2013.01); H01L 29/42356 (2013.01);
Abstract

The present invention provides a method for forming a semiconductor structure, comprising: firstly, a substrate is provided, next, a first dry etching process is performed, to form a recess in the substrate. Afterwards, an ion implantation process is performed to a bottom surface of the recess, a wet etching process is then performed, to etch partial sidewalls of the recess, so as to form at least two tips on two sides of the recess respectively, and a second dry etching process is performed, to etch partial bottom surface of the recess, wherein after the second dry etching process is performed, a lower portion of the recess has a U-shaped cross section profile.


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