The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jun. 06, 2011
Applicants:

Bernhard Rebhan, Haag a. H., AT;

Markus Wimplinger, Ried im Innkreis, AT;

Jürgen Burggraf, Schärding, AT;

Inventors:

Bernhard Rebhan, Haag a. H., AT;

Markus Wimplinger, Ried im Innkreis, AT;

Jürgen Burggraf, Schärding, AT;

Assignee:

EV Group E. Thallner GmbH, St. Florian am Inn, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01L 5/00 (2006.01); G01L 1/24 (2006.01); B30B 15/06 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01L 1/24 (2013.01); B30B 15/062 (2013.01); G01L 5/008 (2013.01); G01L 5/0085 (2013.01); H01L 22/12 (2013.01);
Abstract

A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.


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