The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Sep. 18, 2012
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventor:
Dominik Treiblmayr, Kirchdorf am Inn, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); C08J 7/18 (2006.01); G21H 5/00 (2006.01); B29C 59/02 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 71/04 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 71/04 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29L 2009/005 (2013.01);
Abstract
A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material.