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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9497863 B1

PDFFull Text
Date of Patent:
Nov. 15, 2016

Filed:

Feb. 19, 2015

Wiring substrate and method of making wiring substrate

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yasuhiko Kusama, Nagano, JP;

Hideyuki Tako, Nagano, JP;

Kenji Kawai, Nagano, JP;

Fumihisa Miyasaka, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Charles Pizzuto

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H05K 3/0011 (2013.01); H05K 3/301 (2013.01); H01L 23/145 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15313 (2013.01); H05K 3/007 (2013.01); H05K 3/0032 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10651 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/167 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49146 (2015.01);
Abstract

A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part, and a resin layer filling the hole and supporting the electronic components.

Find Patent Forward Citations

Kusama, Yasuhiko. (2016). Wiring substrate and method of making wiring substrate (U.S. Patent No. 9497863). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9497863

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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