The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Mar. 27, 2014
Applicants:

Matthew J. Adiletta, Bolton, MA (US);

Aaron Gorius, Upton, MA (US);

Myles Wilde, Charlestown, MA (US);

Hugh Wilkinson, Newton, MA (US);

Amit Y. Kumar, Hudson, MA (US);

Inventors:

Matthew J. Adiletta, Bolton, MA (US);

Aaron Gorius, Upton, MA (US);

Myles Wilde, Charlestown, MA (US);

Hugh Wilkinson, Newton, MA (US);

Amit Y. Kumar, Hudson, MA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/02 (2006.01); H01P 3/10 (2006.01); H01P 5/00 (2006.01); H04B 10/40 (2013.01); H04B 10/80 (2013.01); H04B 1/40 (2015.01); H04B 10/90 (2013.01); H04L 12/931 (2013.01);
U.S. Cl.
CPC ...
H01P 5/02 (2013.01); H01P 3/10 (2013.01); H01P 5/00 (2013.01); H04B 1/40 (2013.01); H04B 10/40 (2013.01); H04B 10/803 (2013.01); H04B 10/90 (2013.01); H04L 49/40 (2013.01);
Abstract

Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.


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