The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jan. 24, 2012
Chengjie Zuo, San Diego, CA (US);
Changhan Yun, San Diego, CA (US);
Sang-june Park, San Diego, CA (US);
Chi Shun Lo, San Diego, CA (US);
Mario F. Velez, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Chengjie Zuo, San Diego, CA (US);
Changhan Yun, San Diego, CA (US);
Sang-June Park, San Diego, CA (US);
Chi Shun Lo, San Diego, CA (US);
Mario F. Velez, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A chipset includes a sheet of glass, quartz or sapphire and a first wafer having at least one first circuit layer on a first side of a first substrate layer. The first wafer is connected to the sheet such that the at least one first circuit layer is located between the first substrate layer and the sheet. A second wafer having at least one second circuit layer on a first side of a second substrate layer is connected to the first substrate layer such that the at least one second circuit layer is located between the second substrate layer and the first substrate layer. Also a method of forming a chipset.