The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jun. 17, 2015
Globalfoundries Inc., Grand Cayman, KY;
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
An integrated conductive polymer-solder ball structure is provided. The integrated conductive polymer-solder ball structure comprises a sputter seed layer applied to a wafer structure, one or more conductive polymer pad structures applied to the sputtered seed layer at locations on the wafer structure where one or more solder ball structures will be formed, an electroplating layer applied to portions of the one or more conductive polymer pad structures where a photoresist layer has been exposed, and a solder ball formed on each of the electroplating layers thereby forming the one or more solder ball structures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile