The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Dec. 03, 2015
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Chi-Taou Robert Tsai, Chandler, AZ (US);
Curtiss D. Roberts, Chandler, AZ (US);
Lillian G. Lent, Chandler, AZ (US);
Assignee:
Intel IP Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/66 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H04B 1/40 (2015.01); H04B 1/26 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H04B 1/26 (2013.01); H04B 1/40 (2013.01); H01L 2223/6677 (2013.01);
Abstract
An integrated circuit (IC) comprises a plurality of metal layers; a seal ring arranged around a perimeter of the IC and included in at least a portion of the plurality of metal layers; a first coil included in the IC; and a bypass conductor included in at least one metal layer of the plurality of metal layers and having at least a first end and a second end electrically coupled to the seal ring to form a bypass ring around the first coil.