The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Sep. 18, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Michael Roesner, Villach, AT;
Gudrun Stranzl, Goedersdorf, AT;
Martin Zgaga, Rosegg, AT;
Martin Sporn, Villach, AT;
Tobias Schmidt, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 21/4803 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/12 (2013.01); H01L 23/3157 (2013.01); H01L 24/26 (2013.01); H01L 24/32 (2013.01);
Abstract
A semiconductor chip includes a body having a frontside, a backside opposite the frontside, and sidewalls extending between the backside and frontside, at least a portion of each sidewall having a defined surface structure with hydrophobic characteristics to inhibit travel of a bonding material along the sidewalls during attachment of the semiconductor chip to a carrier with the bonding material.