The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Jan. 31, 2013
Applicant:

Transphorm Inc., Goleta, CA (US);

Inventors:

Rongming Chu, Goleta, CA (US);

Umesh Mishra, Montecito, CA (US);

Rakesh K. Lal, Isla Vista, CA (US);

Assignee:

Transphorm Inc., Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 29/20 (2006.01); H01L 29/423 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 29/4175 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 29/2003 (2013.01); H01L 29/42316 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06183 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13064 (2013.01);
Abstract

Group III-nitride devices are described that include a stack of III-nitride layers, passivation layers, and conductive contacts. The stack includes a channel layer with a 2DEG channel, a barrier layer and a spacer layer. One passivation layer directly contacts a surface of the spacer layer on a side opposite to the channel layer and is an electrical insulator. The stack of III-nitride layers and the first passivation layer form a structure with a reverse side proximate to the first passivation layer and an obverse side proximate to the barrier layer. Another passivation layer is on the obverse side of the structure. Defected nucleation and stress management layers that form a buffer layer during the formation process can be partially or entirely removed.


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