The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jun. 27, 2014
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Kingsuk Maitra, San Jose, CA (US);
Tung Thanh Nguyen, San Jose, CA (US);
Brian Keith Langendorf, Benicia, CA (US);
Julia Purtell, Menlo Park, CA (US);
Rune Hartung Jensen, Cupertino, CA (US);
Ranjit Gannamani, San Jose, CA (US);
Amit Prabhakar Marathe, Sunnyvale, CA (US);
MICROSOFT TECHNOLOGY LICENSING, LLC, Redmond, WA (US);
Abstract
Embodiments are disclosed that relate to implementing semiconductor device cooling systems that leverage awareness of regional voltage and temperature reliability risk considerations. For example, one disclosed embodiment provides a method of implementing a cooling system configured to cool an integrated circuit. The method involves first determining a heat dissipation factor that would reduce each region of the integrated circuit to a reduced temperature in order to maintain an overall failure rate. An analysis is then performed, using an insight about the relative reliability risk of elevated voltage and temperatures, to identify a region of the integrated circuit whose temperature can be permitted to rise without exceeding the overall failure rate, thereby permitting implementation of a cooling system with a reduced heat dissipation factor.