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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9493341 B1

PDFFull Text
Date of Patent:
Nov. 15, 2016

Filed:

Apr. 23, 2013

Planar cavity mems and related structures, methods of manufacture and design structures

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Anthony K. Stamper, Williston, VT (US);

John G. Twombly, Essex Junction, VT (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Steven Meyers

Andrew M. Calderon

Roberts, Mlotkowski, Safran, Cole & Calderon, P.C.

Primary Examiner:

R S Luebke

Assistant Examiner:

Anthony R Jimenez

Int. Cl.
CPC ...
H01H 1/10 (2006.01); B81B 3/00 (2006.01); H01L 41/113 (2006.01); B81C 1/00 (2006.01); H01H 57/00 (2006.01); G06F 17/50 (2006.01); H01H 1/00 (2006.01); H01H 59/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81B 3/0021 (2013.01); B81C 1/00476 (2013.01); B81C 1/00619 (2013.01); G06F 17/5068 (2013.01); G06F 17/5072 (2013.01); H01H 1/0036 (2013.01); H01H 57/00 (2013.01); H01H 59/0009 (2013.01); H01L 41/1136 (2013.01); B81B 2201/01 (2013.01); B81B 2201/014 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/04 (2013.01); B81C 1/0015 (2013.01); B81C 1/00626 (2013.01); B81C 2201/017 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0167 (2013.01); H01H 2057/006 (2013.01); H01L 2924/0002 (2013.01); Y10S 438/937 (2013.01); Y10T 29/42 (2015.01); Y10T 29/435 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49105 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/5313 (2015.01);
Abstract

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

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