The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Aug. 28, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rashed Mahameed, Herzeliya Pituah, IS;

Kristen L. Dorsey, Pittsburgh, PA (US);

Mamdouh O. Abdelmejeed, Alexandria, EG;

Mohamed A. Abdelmoneum, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/8244 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01P 15/125 (2006.01); G01C 19/5733 (2012.01); G01P 15/08 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0051 (2013.01); B81B 3/0021 (2013.01); B81C 1/00166 (2013.01); B81C 1/00246 (2013.01); B81C 1/00531 (2013.01); G01C 19/5733 (2013.01); G01P 15/125 (2013.01); B81B 7/008 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0145 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0742 (2013.01); G01P 2015/0814 (2013.01);
Abstract

A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.


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