The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Apr. 06, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hung Chih Chen, Sunnyvale, CA (US);

Samuel Chu-Chiang Hsu, Palo Alto, CA (US);

Gautam Shashank Dandavate, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/27 (2012.01); B24B 37/32 (2012.01); B24B 7/00 (2006.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 7/00 (2013.01); B24B 7/228 (2013.01);
Abstract

A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.


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