The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jul. 09, 2010
Rainer Pludra, Eitorf, DE;
Dietmar Drofenik, Spielberg, AT;
Johannes Stahr, St. Lorenzen/Mürztal, AT;
Siegfried Götzinger, Vienna, AT;
Liubomir Mareljic, Rottenmann, AT;
Rainer Pludra, Eitorf, DE;
Dietmar Drofenik, Spielberg, AT;
Johannes Stahr, St. Lorenzen/Mürztal, AT;
Siegfried Götzinger, Vienna, AT;
Liubomir Mareljic, Rottenmann, AT;
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT, Leoben-Hinterberg, AT;
Abstract
In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.