Fingerprint recognition semiconductor device and semiconductor device

Abstract

A fingerprint recognition semiconductor device includes an insulation layer, a wiring pattern formed on a lower surface of the insulation layer, and a sensor element flip-chip-connected to the wiring pattern. The sensor element includes an active surface, including a sensor portion that recognizes a fingerprint, and a rear surface, located at a side opposite to the active surface. An encapsulation resin fills a gap between the lower surface of the insulation layer and an upper surface of a wiring substrate, facing the rear surface of the sensor element and connected to the wiring pattern by a connecting member. The entire active surface of the sensor element is covered by underfill formed between the active surface of the sensor element and the lower surface of the insulation layer. The insulation layer includes an upper surface, defining an uppermost surface and free from a wiring layer.