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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9490228 B1

PDFFull Text
Date of Patent:
Nov. 08, 2016

Filed:

Mar. 28, 2014

Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same

Applicants:

Kyoung Soo Park, Uiwang-si, KR;

Soon Young Kwon, Uiwang-si, KR;

Ji Yeon Kim, Uiwang-si, KR;

Young Woo Park, Uiwang-si, KR;

Jae Sun Han, Uiwang-si, KR;

Ja Young Hwang, Uiwang-si, KR;

Inventors:

Kyoung Soo Park, Uiwang-si, KR;

Soon Young Kwon, Uiwang-si, KR;

Ji Yeon Kim, Uiwang-si, KR;

Young Woo Park, Uiwang-si, KR;

Jae Sun Han, Uiwang-si, KR;

Ja Young Hwang, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-Si, Kyeongsangbuk-Do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 9/02 (2006.01); C09J 7/00 (2006.01); C09J 11/00 (2006.01); H05K 3/32 (2006.01); C08K 7/16 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 7/00 (2013.01); C09J 9/02 (2013.01); C09J 11/00 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H05K 3/323 (2013.01); C08K 7/16 (2013.01); C08K 9/02 (2013.01); C09J 2201/36 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29371 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29416 (2013.01); H01L 2224/29424 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/29466 (2013.01); H01L 2224/29471 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15788 (2013.01); Y10T 428/24959 (2015.01); Y10T 428/25 (2015.01); Y10T 428/28 (2015.01); Y10T 428/2848 (2015.01);
Abstract

An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×10/dto 10.0×10/d(particles) per square millimeter (mm) (where d is a diameter of the conductive particles in μm).

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