The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Sep. 10, 2013
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Angie Privett, Hannibal, MO (US);

Roger Brummell, Hannibal, MO (US);

Larry Forbis, New London, MO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); H01C 17/06 (2006.01); H05B 3/26 (2006.01); H05B 3/46 (2006.01);
U.S. Cl.
CPC ...
B32B 37/10 (2013.01); H01C 17/06 (2013.01); H05B 3/262 (2013.01); H05B 3/265 (2013.01); H05B 3/46 (2013.01); H05B 2203/003 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01);
Abstract

A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer.


Find Patent Forward Citations

Loading…