The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Oct. 27, 2011
Applicants:

Yurie Onitsuka, Satsumasendai, JP;

Yousuke Moriyama, Satsumasendai, JP;

Inventors:

Yurie Onitsuka, Satsumasendai, JP;

Yousuke Moriyama, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 23/36 (2006.01); H01L 33/48 (2010.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H05K 1/02 (2013.01); H01L 23/36 (2013.01); H01L 33/486 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H05K 3/0052 (2013.01); H05K 3/0061 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09845 (2013.01);
Abstract

A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring conductor embedded in the insulating substrate and having an exposed portion partially exposed above the protrusion portion or the recess portion from the side surface of the insulating substrate; and a metal member bonded to the lower surface of the insulating substrate. It is possible to suppress occurrence of ion migration between the wiring conductor and the metal member by increasing a distance between the exposed portion and the metal member without increasing a thickness of the wiring board.


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