The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Oct. 15, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventor:

Huang-Kui Chen, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 21/3205 (2006.01); H01L 21/70 (2006.01); H01L 27/088 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 21/823864 (2013.01); H01L 27/0924 (2013.01); H01L 29/66545 (2013.01); H01L 29/7843 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01);
Abstract

The present disclosure provides a semiconductor structure includes a semiconductor layer having a first and a second surface, and an interlayer dielectric (ILD) defining a first metal gate and a second metal gate over the first and second surface, respectively. The first and second metal gate include a first SAC hard mask and a second SAC hard mask, respectively, wherein the first the second SAC hard mask have opposite stress to channel regions underneath the first and second metal gate, respectively. The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming metal gate recesses, forming metal gates and SAC hard masks in the metal gate recesses, respectively.


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