The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Dec. 08, 2014
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Brent Keeth, Boise, ID (US);
Christopher K. Morzano, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/14 (2006.01); H01L 25/065 (2006.01); G06F 13/38 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2006.01); G11C 5/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); G06F 13/385 (2013.01); G11C 5/02 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06555 (2013.01);
Abstract
Various embodiments include apparatuses having stacked devices and methods of forming dice stacks on an interface die. In one such apparatus, a dice stack includes at least a first die and a second die, and conductive paths coupling the first die and the second die to the common control die. In some embodiments, the conductive paths may be arranged to connect with circuitry on alternating dice of the stack. In other embodiments, a plurality of dice stacks may be arranged on a single interface die, and some or all of the dice may have interleaving conductive paths.