The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Jan. 08, 2014
Applicant:
Global Foundries, Inc., Grand Cayman, KY;
Inventors:
Moosung Chae, Englewood Cliffs, NJ (US);
Larry Zhao, Niskayuna, NY (US);
Assignee:
GLOBALFOUNDRIES, INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/528 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76852 (2013.01); H01L 21/76885 (2013.01); H01L 23/53238 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H01L 23/5283 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes selectively depositing a metal capping layer on first sidewalls of a copper line while leaving exposed portions of a dielectric layer that are laterally adjacent to the copper line exposed. An ILD layer is deposited overlying the metal capping layer and the exposed portions of the dielectric layer.